Mini Breadboard with 170 Tie Points (Self-Adhesive)

The Mini Breadboard with 170 Tie Points is a compact solderless prototyping platform designed for rapid circuit experimentation and component testing. Featuring a dense grid and sticky backing, it is well suited to students, makers, and educators working on space-constrained electronics projects.

Compact 170 tie point grid

The breadboard provides 170 solderless connection points arranged in a 17 × 5 × 2 layout within a 1.8 by 1.4 inch footprint. It accommodates standard through-hole components including resistors, LEDs, transistors, and jumper wires for fast hardware testing.

Self-adhesive mounting backing

A durable adhesive backing secures the breadboard firmly to flat surfaces such as robot chassis, project enclosures, and panels. This stable mounting prevents movement during experimentation, keeping jumper connections firmly seated.

Shield and modular integration

The miniature footprint fits directly onto Arduino proto shields and compact hardware assemblies. It offers a dedicated prototyping area for sensor interfacing and temporary circuit additions where workspace on the main board is limited.

Versatile prototyping applications

Designed for rapid hardware iteration, this module is suitable for embedded system experiments, educational demonstrations, and compact IoT devices. It enables quick circuit verification and testing prior to permanent PCB design.