Aluminum Passive Thin Heatsink for LattePanda Mu Compute Module

The Aluminum Passive Thin Heatsink is an all-metal cooling solution engineered specifically for the LattePanda Mu Compute Module. Built from corrosion-resistant aluminium alloy with integrated heat dissipation fins, it effectively absorbs and transfers heat away from the onboard processor. It is ideal for makers, developers, and educators integrating the LattePanda Mu into custom carrier boards and ventilated enclosures.

Durable aluminium alloy construction

Machined from corrosion-resistant aluminium alloy, the heatsink delivers reliable thermal conductivity and physical protection for the compute module. Its compact 70 x 45 x 11 mm dimensions and 50 g weight ensure seamless integration with carrier boards in tight spaces.

Phase change thermal interface

The heatsink is supplied with high-grade phase change material to maximise heat transfer directly from the CPU. Remember to remove the protective film before aligning the heatsink with the processor and mounting holes.

Even spring screw mounting

Fastening is secured with three spring screws that must be tightened gradually in a circular pattern to prevent uneven pressure or damage to the CPU die. Ensure the LattePanda Mu is fully powered down before installation or removal.

Airflow and handling requirements

This passive heatsink is not designed for standalone fanless operation and requires forced airflow from an external fan or ventilated chassis. Avoid direct skin contact with the aluminium surface while powered to prevent burn injuries.