Aluminum Heat Sink with 3M Thermal Adhesive Tape (28x28x11mm)

This compact aluminium heat sink provides reliable passive cooling for heat-generating electronic components. Featuring pre-applied 3M-8810 thermal adhesive tape, it offers an easy-to-install thermal management solution for makers, students, and electronics hobbyists.

Passive thermal dissipation

The aluminium structure enables effective passive heat dissipation without requiring active fans or power connections. This helps maintain stable operating temperatures for sensitive silicon and power devices.

Pre-applied 3M-8810 adhesive

Factory-fitted with 3M-8810 thermal adhesive tape, the heat sink bonds securely to target chips without requiring separate thermal paste or mechanical fasteners. The adhesive interface provides efficient thermal transfer from the component to the heatsink body.

Compact physical footprint

With dimensions of 28x28x11mm, this heat sink delivers thermal dissipation in a low-profile format. Its compact size allows it to fit onto crowded circuit boards and inside compact project enclosures.

Component application support

The heat sink is designed for cooling integrated circuits, motor drivers, and power modules across robotics and microcontroller builds. It provides a simple drop-in thermal solution wherever board components encounter moderate thermal loads.