Aluminum Fanless Heatsink for LattePanda Mu Compute Module

The Aluminum Fanless Heatsink is a dedicated passive cooling solution designed specifically for the LattePanda Mu Compute Module. Constructed from durable aluminium alloy, it delivers completely silent thermal management for makers, engineers, and embedded system developers. It ensures stable operating temperatures while allowing seamless integration with custom carrier boards.

Silent passive thermal dissipation

The heatsink uses integrated cooling fins to quickly draw heat away from the processor without any moving parts or fan noise. It provides a rated thermal capacity of 6W TDP with a 35°C temperature rise, and 10W TDP with a 60°C temperature rise.

Durable aluminium alloy housing

Crafted from all-metal, corrosion-resistant aluminium alloy, the enclosure offers robust physical protection for your compute module. The unit measures 70 x 45.5 x 33 mm, weighs 100 g, and supports wall-mounted configurations.

Phase change thermal interface

The cooler includes pre-applied high-quality phase change material to maximise thermal conductivity between the CPU and the aluminium block. Users must peel off the protective film from the thermal material prior to mounting the board.

Spring screw installation and safety

The heatsink secures using three spring screws that must be tightened evenly in a circular sequence to prevent damaging the CPU die through uneven force. The LattePanda Mu must be powered off during installation, and direct skin contact with the case should be avoided during operation to prevent burns.